Samsung Begins Mass-Producing the Exynos 7 Dual 7270 SoC for Wearables
Samsung has just announced mass production of their first wearable SoC that is built upon the company’s 14nm FinFET process technology. The company has been expanding their 14nm technology since it was introduced back in 2015, and now they are bringing it to all sorts of wearables. This also marks the first in its class to offer full connectivity and LTE modem integration right into the chip.
The Exynos 7 Dual 7270 is made up of 2 ARM Cortex-A53 cores, which has been able to cut down on power usage by 20% when compared to its predecessor built on a 28nm process. The SoC also features an integrated Cat.4 LTE 2CA modem so the wearable doesn’t have to be connected to your smartphone in order to use cellular service. On top of all that, the Exynos 7 Dual 7270 also includes the traditional Wi-Fi, Bluetooth, FM and GNSS features.
The chip also utilizes Samsung’s SiP(system-in-package)-ePoP (embedded package-on-package) technology. This means the Exynos 7 Dual 7270 stacks the AP, DRAM, NAND flash memory and the power management IC so that it can reduce the height by 30% compared to its predecessors. This, along with the 14nm FinFet process technology makes it ideal for wearable technology like smartwatches.
Samsung has said the Exynos 7 Dual 7270 is currently in mass production and that a a reference platform that consists of the chip, NFC and various other sensors are available for OEMs who want to utilize the technology. This could end up being good competition to Qualcomm’s Snapdragon Wear 2100 chip, and it’s something that the company needs since it just released a revised earnings guidance for the third quarter of 2016.
Samsung needs to do anything they can to make up the financial lose that will come from the current Galaxy Note 7 battery debacle.
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